La plateforme U8500 de St Ericsson lance la vraie 3D mobile

Le futur approche St Ericsson, fusion entre ST-NXP Wireless et Ericsson Mobile Platform, viennent d'annoncer la plateforme U8500, la plus puissante actuellement largement devant le OMAP3 de Texas Instruments. Elle est basée sur un processeur ARM dual Cortex™- A9 et supporte Android. Cette puce possède une puissance d'affichage 3D exemplaire. Voir en dessous les spécifications en anglais ci dessous:


  • Full HD 1080p camcorder, multiple codecs supported (H264 HP, VC-1, MPEG-4)
  • High-resolution, touchscreen display support up to XGA
  • Simultaneous dual display support
  • High performance 3D graphics, support for OpenVG 1.1 and OpenGL ES 2.0
  • Dual camera support with Integrated ISP 18 Mpixel and 5 Mpixel
  • Wi-Fi, Bluetooth and GPS enabled platform
  • Built-in USB 2.0, HDMI out
  • Support for multiple operating systems, Symbian, Android and Linux-based platforms
  • Optional support for mobile TV standards


  • Highly efficient, low-power ARM dual Cortex™- A9 processor
  • Dual multimedia DSP for low-power, flexible media processing
  • High-bandwidth LP-DDR2 interface
  • ARM  Mali™ 400 GPU and NEON®CPU extensions
  • State-of-the-art HSPA (High-Speed Packet Access) Release 7 modem
  • Unique audio architecture with a wide range of audio codecs supported
  • Advanced power saving architecture enabling class-leading audio and video playback times